|
科图分类法:
|
TN47-62 版次： |
|
中图分类法:
|
TN47-62 版次： |
|
题名:
|
Handbook of 3D integration : [ technology and applications of 3D integrated circuits /] / , |
|
出版发行:
|
出版地： Weinheim : 出版社： Wiley-VCH, 出版日期： c2012. |
|
载体形态:
|
xxvi, 773 p. : ill. (some col.) ; 24 cm. |
|
附注:
|
Volumes 1 and 2. |
|
附注:
|
Originally published in 2 separate vols. in 2008. |
|
主题词:
|
Integrated circuits. |
|
主题词:
|
Integrated circuits Design and construction. |
|
主题词:
|
Semiconductor wafers. |
|
主题词:
|
Three-dimensional imaging. |
|
主要责任者:
|
Garrou, Philip E. |
|
主要责任者:
|
Bower, Christopher Andrew. |
|
主要责任者:
|
Ramm, Peter. |
|
索书号:
|
1 |