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科图分类法:
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TN405.96 版次： |
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中图分类法:
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TN405.96 版次： |
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著者:
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Harman, George G. |
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题名:
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Wire bonding in microelectronics / , |
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版次:
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3rd ed |
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出版发行:
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出版地： New York 出版社： McGraw-Hill 出版日期： c2010 |
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载体形态:
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xx, 426 p. ill. 24 cm. + 1 CD-ROM (4 3/4 in.) |
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附注:
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Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989. |
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主题词:
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Wire bonding (Electronic packaging) Production control. |
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主题词:
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Electronic packaging Reliability. |
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主题词:
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Electronic packaging Defects. |
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主题词:
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Semiconductors Failures. |
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主要责任者:
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Harman, George G. |
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索书号:
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1 |